PCB Laser Depaneling - A Laser Precision Laser Cutting,SMTfly-LJ330 Features:
1). High-precision: Low-drift galvanometer combined with fast
ironless linear motor system platform for fast cutting. Keep high
precision in micrometers.
2). Easy to learn: Self-developed Windows control system,
easy-to-use Chinese/English interface, and friendly Views, powerful
and diverse, easy to operate.
3). Intelligent Automated: Using high-precision CCD to
automatically locate and focus, positioning is fast and accurate,
without manual intervention, simple operation, realize the
one-button mode of the same type, greatly improve production
efficiency. Automatic galvanometer correction, auto focus, full
implementation Automation, using laser displacement sensor to
automatically adjust the height of the focus to the table, to
achieve rapid alignment, saving time.
4). Suitable for cutting: FPC, PCB, chip cutting, cell phone camera
module. Fragments, layers, blocks, or selected areas are cut and
formed directly. The cutting edges are neat, smooth, smooth, and
free of burrs. Overfilled plastic. Products can be arranged in a
matrix for automatic positioning and cutting, especially for fine,
difficult and complex patterns .
5). High-performance lasers: Adopting solid-state UV lasers from
international brands, with good beam quality and focused spot.
Small, uniform power distribution, small thermal effect, small kerf
width, high cutting quality, etc.
Samples After PCB Laser Depaneling Machine,PCB Separator:
PCB Laser Depaneling - A Laser Precision Laser Cutting Specification:
Laser Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength 355nm
Laser Source Optowave UV 10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of
Linear Motor
±2μm
Repetition Precision of Worktable of
Linear Motor
±1μm
Effective Working Field 300mmX300mm(Dual Tables)
Spot diameter 20±5μm
Working temperature/humidity 20±2 ℃/＜60 %
Machine Dimension 1250mm*1300mm*1600mm
Machine Weight 1500KG
PCB Laser Depaneling - A Laser Precision Laser Cutting Description:
Neat and smooth edge, no burr or overflow
Wide application range, including FPC exterior cutting, profile
cutting, drilling, opening window for
covering, etc. Laser wavelength: 355nm
Rated power: 10W/15W@30KHz
Galvanometer working field Per One Process: 30 × 30mm
Power consumption for the hole machine: 2KW
Cutting Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
